Tokyo Sensor Show
Exhibition Dates: February 17-19, 2027 Exhibition Venue: Tokyo Big Sight, Japan Hosting address: 3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan Exhibition area: 16,000 square meters Audience size: 18,240 Exhibitors: 375 Organizer: Reed Exhibitions Click to apply for a booth at the Tokyo Sensor Show now Click to purchase the exhibitor directory (exhibition catalog) for the Tokyo Sensor Show. Tokyo Sensor Show ticket reservations (including early bird tickets, exhibition tickets, single-day tickets, and limited-time free tickets)Tokyo Sensor Show ticket information:
Exhibition ticket (February 17-19, 2027): 300.00 yuan

Ticket Reservation Guide:
1. Visit the relevant exhibition page or the official website of the Tokyo Sensor Exhibition. 2. Click the "Ticket Reservation" or "Apply Now" button to enter the reservation page. 3. Fill in your personal information as prompted, including your name, contact number, and ID number. 4. Submit the application after confirming that the information is correct. 5. After receiving the confirmation message, keep the confirmation information from the SMS, WeChat, or email. Introduction to the Tokyo IC & Sensor Packaging Technology Exhibition, Japan:The IC & SENSOR PACKAGING TECHNOLOGY EXPO in Tokyo, Japan, is a leading professional packaging technology exhibition in Japan. It is an exhibition dedicated to showcasing packaging technologies for semiconductors, sensors, and other electronic devices.
JUZHAN has organized several high-quality companies to participate in the exhibition! The IC & SENSOR PACKAGING TECHNOLOGY EXPO in Tokyo, Japan is a great place to conduct business negotiations with engineers from the semiconductor, sensor, electronic equipment, and automotive industries.
The previous IC & Sensor Packaging Technology Expo in Tokyo, Japan, covered a total area of 16,000 square meters, with 375 exhibitors from countries including China, South Korea, Taiwan, India, Thailand, Malaysia, Singapore, Turkey, and Germany, attracting 18,240 visitors. This highly professional expo achieved excellent trade results, drawing numerous high-tech equipment enthusiasts, users, and industry professionals .
Scope of exhibits:Equipment and supplies, packaging materials/components, IC packaging analysis/simulation software, semiconductor devices/testing equipment
SATS/Contract Design Services, Electroplating/Etching Materials and Equipment, MEMS Equipment/Packaging Equipment

References:
Tokyo IC & Sensor Packaging Technology Exhibition
IC & SENSOR PACKAGING TECHNOLOGY EXPO- Host region:
- Tokyo, Japan
- Venue:
- 3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan
- Exhibition area:
- 16,000㎡
- Number of audience members:
- 18,240 people
- Industry:
- Semiconductor Exhibition Japan Semiconductor Exhibition